Metal assisted etching is a new promising technique for Sili- con nanowires fabrication, but also for generating a new class of porous semiconductors with precise and controlled mor- phology, unavailable by electrochemical etching. The process and the morphology seem to be independent on substrate dop- ing, but only on the crystallographic directions and metal pat- terning at the top surface. A preliminary investigation on some possible patterning techniques is reported, using porous silicon layers as pre-patterning tool, porous alumina and polystyrene nanospheres. The influence of the masking pro- cedure on the final array of nanostructures is discussed. Final morphology resulting from polystyrene nanosphere based patterning and metal assisted etching.

Self-catalytic etching of silicon: from nanowires to regular mesopores / Boarino, Luca; M., Destro; S., Borini; N., Pugno; A., Chiodoni; F., Bellotti; Amato, Giampiero. - In: PHYSICA STATUS SOLIDI. A, APPLICATIONS AND MATERIALS SCIENCE. - ISSN 1862-6300. - 206:(2009), pp. 1250-1254. [10.1002/pssa.200881068]

Self-catalytic etching of silicon: from nanowires to regular mesopores

BOARINO, LUCA;AMATO, GIAMPIERO
2009

Abstract

Metal assisted etching is a new promising technique for Sili- con nanowires fabrication, but also for generating a new class of porous semiconductors with precise and controlled mor- phology, unavailable by electrochemical etching. The process and the morphology seem to be independent on substrate dop- ing, but only on the crystallographic directions and metal pat- terning at the top surface. A preliminary investigation on some possible patterning techniques is reported, using porous silicon layers as pre-patterning tool, porous alumina and polystyrene nanospheres. The influence of the masking pro- cedure on the final array of nanostructures is discussed. Final morphology resulting from polystyrene nanosphere based patterning and metal assisted etching.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11696/30971
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